2004-09-29
Poszukiwany jest partner do projektu w konkursie łączonym w priorytecie NMP. Poniżej znajdziecie Państwo opis projektu w języku angielskim.
Zgłoszenia prosimy przesyłać na adres zbigniew.turek@kpk.gov.pl
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IST-NMP-3 Materials, Equipment and Processes for Production OF Nano-Photonic and Nano-Electronic Devices


Introduction
Semiconductor fabrication involves use of both process and inspection equipment. Current and future feature dimensions of semiconductors are of nano-metric dimensions and require at least the following characteristics:

a.Suitable inspection system
b.Positioning accuracy and stability
c.Handling the inspected device with minimum stress
d.Minimal particle contamination of the inspected device from the handling system

Several techniques need to be used in order to meet the mentioned requirements. These techniques combine an inspection system, a motion system with a surface to lay and hold the device to be inspected or manipulated and a clean environment.
Each of the mentioned techniques presents new challenges to be suited for use at the nanometric scale.

This proposal will specifically address the third focus of the joint call, research on processes and equipment for very advanced nano-structuring and nano-patterning technologies (ITRS32 nm node and beyond) required for the volume production of nano-electronic and nano-photonic integrated circuits.

The work will focus on the system requirements and practical proposals of inspection technology addressing very advanced nano-structuring and nano-patterning technologies, required for the high volume production of nano-electronics at competitive costs. The proposed technology is aimed to work in atmospheric conditions (not in vacuum chambers), able to meet the ITRS 32 nm node and beyond requirements for feature resolution with a high throughput and a relative low cost (compared with other alternatives).
Project Specific Research Areas

The objective of this project is to develop new technology for inspecting wafers at the 32nm node, comprising of the following 5 sub-systems:

a.Inspection System
b.Motion System
c.Chuck System
d.Airflow System
e.Vibration Isolation system
f.All of the above to be validated in the challenging semiconductor nano-electronic integrated devices manufacturing environment

Project Deliverables

The project will deliver new generation atmospheric semiconductor inspection technology suitable to inspect and handle nanometric scale devices. This technology will be composed basically of an inspection system and a platform providing suitable work and environmental conditions for this inspection system.

Instrument used
Specific Targeted Research Project (STREP)

Call information
Call identifier FP6-2004-IST-NMP-2
NMP-2004-IST-NMP-3 - Materials, Equipment and Processes for Production OF Nano-Photonic and Nano-Electronic Devices

Participants sought:

==Partner sought==:Semi-conductor manufacturing facility
Test and characterize the inspection tool for the relevant manufacturing processes in a semiconductor fab production line
==Partner sought==:Engineering/research institute specializing in airflow design and contamination
Design and develop airflow models and associated elements i.e. air filters, air suction devices to meet SEMI Class 1 airborne dynamic contamination figures . Other cleaning mechanisms, temperature control and distribution systems.
==Partner sought==:Academic/Research institute
Develop a wafer support concept (chuck), using materials and manufacturing processes to enable producing a unit providing accurate and repeatable wafer holding and transportation with minimum stress force applied and guarantee a site flatness < 32 nm and back side contamination less than 3 particles bigger than 0.1 micron, added.
==Partner sought==:Engineering/research company specializing in vibration isolation system development and manufacturing
Vibration/isolation system development
==Partner sought==:Engineering/research company specializing in precise motion system development and manufacturing
Motion system development

Time table
Proposal is to be submitted by Oct 14, 2004
The project duration is 2.5 years.